To remain competitive, particularly during a global pandemic, manufacturers must find ways to do more with less. Fulfill more orders in less time. Build more products with fewer resources. Drive more business with less environmental impact. They achieve the impossible by replacing outdated processes with newer technologies — for example, low-pressure injection molding instead of potting.
Potting involves pouring liquid resin over electrical parts to fill the assembly and form a protective, insulating encasement. While the process can produce effective results, potting has numerous disadvantages, including a complex, multi-step process, long curing periods, and the potential for shrinking. Furthermore, because potting compounds cure exothermically, cure reactions can generate enough heat to damage delicate electronic parts, such as PCBs and sensors. Ultimately, the risks and disadvantages equate to higher production costs, longer cycle times, and lower levels of quality and consistency.